Physical AI is scaling
Humanoids enter real production in 2025–2027. Makers are choosing their interconnect now — before they build millions of units.
the nervous system for physical ai · FG-200 Rev A
Light-speed data between a machine's senses and its brain — qualified for the body copper can't survive. FG-200 replaces the harness with a link that is locked, lossless, and weightless.

The Problem
Machines that sense, decide, and act have moved past locomotion and into on-platform intelligence. But intelligence is only as good as the substrate carrying its signals. That substrate is copper, and it is the weakest link in the machine.
Already solved
Hasn't adapted
Why Copper Fails
This is not fixable with better cable. Four independent failure modes converge inside a moving body — and above ~25 Gbps over meter-scale spans inside an actuator cluster, optical is the only medium that closes.
Joints flex 100k–1M cycles per year. Copper conductors crack; harness replacement is a top field-reliability complaint.
Vibration raises contact resistance ~100× at flexing connectors — and the damage is irreversible.
40–60 servo inverters switch 48–400 V at 10–30 kHz, radiating straight through shielded twisted-pair.
2.2–3.1 lbs of harness costs 30–60 min of runtime. Distal mass costs the motors 10–20× more.
Why Now
None of this was buildable five years ago. Three independent trends arrived together — and the wiring decision is being locked right now.
Humanoids enter real production in 2025–2027. Makers are choosing their interconnect now — before they build millions of units.
Co-packaged optics went from lab to data-center product. Shared-wafer runs let small teams get them made cheaply.
Dexterous hands need 5–10 Gbps at the wrist for fingertip cameras and touch. Copper can't; co-packaged optics can.
The Technology
Normal light-chips burn tiny heaters to stay tuned as temperature swings. A moving robot can't spare the power or the weight. So the light path straddles silicon and a polymer whose response to heat is the opposite of silicon's. The two cancel — the chip stays locked by itself, with no heaters on the routing layer.
0.54
0 W
−40 → +85 °C
Architecture
Cameras + LIDAR
4.0 W
AI chip + data switch
70 W
Safety chip + walk
5.0 W
Motor + touch + camera
1.8 W each
The optical engine sits beside a standard AI chip on one shared base — no lossy electrical run to a pluggable module.
A spare laser takes over in under 10 µs if one fails — faster than a blink.
Three-layer architecture built to pass the ISO 13482 personal-robot safety standard.
Business Model
ARM for physical-AI interconnect. We don't build robots. We own and license the architecture that connects a machine's senses to its brain — the substrate under every embodied platform, whoever wins.
Advise on the copper-to-light switch and build the transition hardware that makes adoption immediate.
Others build to our design for an upfront fee plus per-unit royalty. Scales without us building factories.
Work straight with defense programs and primes that require US-made, ruggedized parts.
Market
Revenue per robot = interconnect license + integration fee + digital-twin system + royalties. One patented design; each new market costs less to enter than the last.
~$30B / yr
by 2035, across all five markets
~$1.5B / yr
humanoid interconnect — our wedge
$50–150M / yr
reachable early share
First market
Highest value
Go-to-Market
| Segment | China status | FG-200 positioning |
|---|---|---|
| Consumer ($10–30k) | China dominates | We skip it |
| Defense / tactical edge | Banned (export control) | ITAR-compliant, ruggedized — our main entry |
| Western hand-robots | Does not compete | Gives the data room for fingertip cameras |
Defense is the wedge: highest value per unit, hardest for legacy copper rivals to enter, and fully aligned with US supply-chain policy.
Contact
Today that path is being set in copper — by default, because no one changed it. FG-200 sets it in light: US-aligned, patent-protected, and something copper physically cannot match.
USPTO App. No. 64/065,855